| Manufacturer |
Xilinx Inc. |
| Product Category |
Embedded - System On Chip (SoC) |
| Speed |
667MHz |
| Series |
Automotive, AEC-Q100, Zynq®-7000 XA |
| RAM Size |
256KB |
| Packaging |
Tray |
| Flash Size |
- |
| Part Status |
Active |
| Peripherals |
DMA |
| Architecture |
MCU, FPGA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Number of I/O |
130 |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case |
484-BBGA, FCBGA |
| Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature |
-40°C ~ 125°C (TJ) |
| Supplier Device Package |
484-FCBGA (23x23) |
