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LPC18S30FET256E

Manufacturers: NXP USA Inc.
Product Category: Embedded - Microcontrollers
Data Sheet: LPC18S30FET256E
Description: IC MCU 32BIT ROMLESS 256LBGA
RoHS status: RoHS Compliant
Attribute Attribute Value
Manufacturer NXP USA Inc.
Product Category Embedded - Microcontrollers
Speed 180MHz
Series LPC18xx
RAM Size 200K x 8
Core Size 32-Bit
Packaging Tray
EEPROM Size -
Part Status Active
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Mounting Type Surface Mount
Number of I/O 164
Core Processor ARM® Cortex®-M3
Package / Case 256-LBGA
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Program Memory Size -
Program Memory Type ROMless
Operating Temperature -40°C ~ 85°C (TA)
Supplier Device Package 256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V

In Stock 69 pcs

Refrence Price ($) 1 pcs 100 pcs 500 pcs
$10.75 $10.54 $10.32

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