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67SLG100100100PI00
| Manufacturers: | Laird Technologies EMI |
|---|---|
| Product Category: | RFI and EMI - Contacts, Fingerstock and Gaskets |
| Data Sheet: | 67SLG100100100PI00 |
| Description: | METAL FILM OVER FOAM CONTACTS |
| RoHS status: | RoHS Compliant |
| Attribute | Attribute Value |
|---|---|
| Manufacturer | Laird Technologies EMI |
| Product Category | RFI and EMI - Contacts, Fingerstock and Gaskets |
| Type | Film Over Foam |
| Shape | Rectangle |
| Width | 0.394" (10.00mm) |
| Height | 0.394" (10.00mm) |
| Length | 0.394" (10.00mm) |
| Series | SMD Grounding Metallized |
| Plating | - |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shelf Life | - |
| Part Status | Active |
| Shelf Life Start | - |
| Attachment Method | Solder |
| Plating - Thickness | - |
| Operating Temperature | -40°C ~ 70°C |
| Storage/Refrigeration Temperature | - |
In Stock 408 pcs
| Refrence Price ($) | 1 pcs | 100 pcs | 500 pcs |
|---|---|---|---|
| $0.00 | $0.00 | $0.00 |
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