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TS391SNL250
| Manufacturers: | Chip Quik, Inc. |
|---|---|
| Product Category: | Solder |
| Data Sheet: | TS391SNL250 |
| Description: | THERMALLY STABLE SOLDER PASTE NO |
| RoHS status: | RoHS Compliant |
| Attribute | Attribute Value |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Product Category | Solder |
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Series | - |
| Process | Lead Free |
| Diameter | - |
| Flux Type | No-Clean |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Shipping Info | - |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
In Stock 13 pcs
| Refrence Price ($) | 1 pcs | 100 pcs | 500 pcs |
|---|---|---|---|
| $69.95 | $68.55 | $67.18 |
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