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TC1-200G
| Manufacturers: | Chip Quik, Inc. |
|---|---|
| Product Category: | Thermal - Adhesives, Epoxies, Greases, Pastes |
| Data Sheet: | TC1-200G |
| Description: | HEAT SINK COMPOUND - HIGH DENSIT |
| RoHS status: | RoHS Compliant |
| Attribute | Attribute Value |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Product Category | Thermal - Adhesives, Epoxies, Greases, Pastes |
| Type | Silicone Compound |
| Color | White |
| Series | - |
| Features | - |
| Shelf Life | 60 Months |
| Part Status | Active |
| Shipping Info | Shipped from Digi-Key |
| Digi-Key Storage | - |
| Shelf Life Start | Date of Manufacture |
| Size / Dimension | 200 gram Jar |
| Thermal Conductivity | 0.67W/m-K |
| Usable Temperature Range | - |
| Material Flammability Rating | - |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
In Stock 3 pcs
| Refrence Price ($) | 1 pcs | 100 pcs | 500 pcs |
|---|---|---|---|
| $49.95 | $48.95 | $47.97 |
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